Samsung Electronics and Advanced Micro Devices (AMD) have recently agreed to enhance their strategic partnership by signing a memorandum of understanding (MoU) focusing on advancing AI memory and computing technologies. The collaboration will involve Samsung supplying AMD with its cutting-edge high-bandwidth memory, HBM4, for the upcoming Instinct MI455X AI accelerators. Additionally, the agreement includes provisions for delivering optimized DDR5 memory for AMD’s sixth-generation EPYC processors, as detailed in a joint statement by the companies.
The collaboration will also explore potential ventures in semiconductor manufacturing, with Samsung’s foundry business being positioned as a potential partner for producing future AMD chips. This agreement further solidifies the existing relationship between the two companies, with Samsung already providing HBM3E memory for AMD’s MI350X and MI355X accelerators. Samsung is expected to take on a more significant role as a supplier of advanced memory for AMD’s upcoming AI hardware generation under this new agreement.
In a separate development, AMD recently announced a significant deal with Meta Platforms, the parent company of Facebook, valued at up to $60 billion over the next five years. Meanwhile, Samsung has been strategically positioning itself to strengthen its presence in the high-bandwidth memory market, where it faces tough competition from SK Hynix. According to Counterpoint, Samsung currently commands approximately 22 percent of the global HBM market, trailing SK Hynix, which leads with a market share of around 57 percent.